WirelessDayIntro

Hai voglia di approfondire le tecnologie wireless emergenti e di dare uno sguardo al futuro?
Se non vuoi farti sfuggire questa opportunità puoi partecipare al “Wireless Day” organizzato da Arrow Electronics il 15 maggio, il primo evento presentato direttamente dai leader di mercato del M2M: Atmel, Cypress, Dynaflex, Freescale, Gemalto / Cinterion, Linear Technology, LS Research, Microchip, NXP Semiconductors, Redpine, STMicroelectronics, Telit, Texas Instruments

Durante questo on-day-event si spazierà dal Cellular all’NFC passando attraverso le tecnologie short range come Bluetooth, WiFi, Zigbee e Sub-GHz.

Nel corso dell’evento è previsto anche uno spazio espositivo dove i partecipanti potranno testare direttamente le soluzioni, demo-board e prodotti, confrontandosi direttamente con i tecnici di ciascun fornitore presente.

WirelessDay

Questi gli argomenti proposti dalle Case presenti:

STMicroelectronics:

  • Moduli WiFi solutions SPWF01Sx.11
  • Bluetooth Low Energy solutions STBLC01
  • New SW Stack in SubGHz SPIRIT1Q
  • Smart Energy and Zigbee IP STM32W+
  • Triplo Front End Radio 2.4G STM32L1W

Atmel:

New transceivers generation SoC ultra low power: AT86RF233 and ATMegaRFR2 family

  • New ZigBee Light Link and Low Weight Mesh: overview stacks from Atmel
  • Atmel Studio 6 – Wireless Composer

Texas Instruments:

  • WMBUS 169Mhz LPRF
  • WiFi solutions
  • BT solutions
  • NFC solutions

Freescale:

  • Kinetis KW01: sub-1 GHz radio and ARM Cortex – M0+ MCU for Ultra low power wireless applications
  • Kinetis KW20 : RF tranceiver and ARM Cortex M4 MCU for ZigBee Wireless Solutions Wireless charging application

NXP:

Introduction – MIFARE and RFID standards

  • RFID Technology and NFC revolution
  • NFC Ecosystem and market trends
  • NFC Use cases for industrial applications
  • NFC and RFID Solutions from NXP

Cypress:

  • Cypress wireless technologies
  • Wireless product portfolio
    – Front Ends
    – Companion chip
    – PRoC UI
  • Remote Control Application
  • Models and Toys  Application

Linear Technology:

  • Time synchronized Smart Mash network
  • Dust Networks peculiarity and advantages
  • WSN applications (why & where DUST fits well)
  • WSN and Energy Harvesting integration

Telit:

  • Product overview 2G to 4G
  • Form factor philosophy
  • FOTA, Remote AT, stack TCP/IP, SSL, m2mLocate, MMS, new anti Jammer etc.
  • M2MAir services overview

Gemalto / Cinterion:

  • Product overview 2G to 4G
  • Form factor philosophy

Redpine:

  • Product overview from Chip Set to Module and Systems
  • Wi-Fi Modules:
    – N-LINK SDIO/SPI Interfaces
    – Connect-io-n
    – WiSeConnect Wi-Fi Direct; All Enterprise Security; Access Point
    – Embedded; SPI, UART, USB Interface
  • 1×1 Wi-Fi 802.11n , BT 4.0 Dual-mode Combo Chipset with ZegBee Interface
  • The Future of RTLS:
    – First in the world Wi-Fi Dual Band Bidirectional TAG
    – From TAG to the Engine to the Localization : Demo

Microchip:

  • WiFi solutions
  • BlueTooth solutions
  • 2.4GHz e 868MHz tranceivers and modules low-cost/low-power
  • Zigbee and MiWi wireless network library
  • Microcontrollers ultra-low-cost/extreme-low-power with embedded radio
  • Keeloq 3:128 bit encrypting library sub-GHz

LSResearch:

  • Company overview
  • Module presentation con particolare focus su TiWi-BLE e TiWi-uB2
  • Road Map
  • Drivers & support with special attention on support

L’evento si terrà presso il Zanhotel & Meeting Centergross Hotel di Bentivoglio (BO) il 15 maggio 2013.

http://goo.gl/XcSA1